INDUCFLOW designs and manufactures copper-iron co-fired power inductors, TLVR inductors and molded SMD inductors — combining low DCR, high saturation current and compact footprints for the most demanding power stages.
Every series is built on our copper-iron co-fired platform, delivering low winding losses and stable inductance under high transient loads.
Copper-iron co-fired construction unifies winding and core in one monolithic body — the lowest loss per ampere we offer.
Explore series →1:1 trans-inductors for multi-phase TLVR topologies — ultra-fast transient response for GPU, CPU and ASIC core rails.
Explore series →One-piece molded power inductors with metal-alloy powder core — shielded, robust and cost-efficient at volume.
Explore series →Our inductors are specified where every milliohm and every millimetre counts.
Multiphase VRM and vertical power delivery for AI accelerator platforms.
Compact, low-loss inductors for optical module DC-DC stages in AI networks.
ADAS, cockpit, on-board DC-DC and BMS — AEC-Q200 compliance path, -40~125°C.
Server PSUs, industrial power supplies and energy-storage converter stages.
Co-firing copper windings and iron-based magnetic body in a single process removes the interfaces where traditional inductors lose efficiency.
Monolithic copper path cuts conduction losses in high-current rails.
Metal-alloy magnetic body degrades gracefully instead of collapsing at Isat.
Handle more amps per mm² of board area than wound or laminated alternatives.
Custom geometries, inductance values and heights engineered to your power stage.
Free samples for qualified designs. Typical response within 24 hours.